FUJI
 

New product announcement

July 23, 2007

High-speed Multipurpose Mounter XPF

The revolutionary XPF is an industry first that achieves automatic head changeover during operation.
This machine can be both a high speed chip shooter and a multipurpose mounter with its ability to automatically perform head changeover. This allows for optimal part allocation within a borderless line.
A rapid improvement in line throughput is achieved because the XPF is highly efficient and no time is wasted during setup.
The main features are shown below.
  1. The XPF can use high speed heads to place small chips, multi-functional heads and glue dispensing heads and also supports automatic head changeover during operation.
  2. There are two types, the XPF-L and XPF-S depending on the parts supply.
  3. Board tray units are available to easily support various tray types.
  4. The XPF can also use Fuji Intelligent Feeders which until now were used with the NXT. Verification and traceability functions are supported and it is possible to use non-stop supply of tray parts.
The main specifications are shown below.
  • Parts that can be used on the XPF: 0402 ~ 45x150 mm
  • Placing tact: 0.144 seconds 25000 CPH (single nozzle: 0.4 seconds 9000 CPH)
  • Placing accuracy: for parts such as chip parts ±0.050 mm, QFP parts ±0.030 mm
  • Panel size 50 x 50 ~ 457 x 356 mm t=0.4 ~ 5.0 mm

Scaleable Placement Platform NXT - High Accuracy Module M6SP

The latest module addition to the NXT can be used on the same platform as existing modules in a line when placing a mixture of bare die and SMD parts and a greater than standard degree of accuracy is required.
The new model for the “ever evolving NXT placement platform” can utilize the numerous functions and optional units that were developed for the original NXT.
The M6SP is able to maintain the tact time of existing modules while also placing parts with a high degree of accuracy. The existing head types and the newly developed, highly accurate G04 placing head which achieves a high productivity, can be used with the new module to achieve this high degree of accuracy. Various supply modes are supported, including direct die feeders which can supply silicon wafers. Leading edge placement methods, including placement of flip chips using “system-in-package” are supported.
The main features are shown below.
  1. The M6SP is a newly designed high rigidity module.
  2. This module is equipped with a high resolution camera.
  3. Placing accuracy is ±18 um (3-sigma)
The main specifications are shown below.
  • Parts that can be used on the M6SP: 0402 ~ 74 x 74 mm
  • Placing tact: 17000 CPH (when using a H12S head)
  • Placing accuracy: for parts such as chip parts ±0.040 mm, Flip chips and QFP parts ±0.018 mm
  • Panel size 50 x 50 ~ 520 x 610 mm t=0.4 ~ 6.0 mm