business
FPM-Trinity technology | Electronic device 3D printer
Complete electronic device manufacturing in a single machine
The FPM-Trinity is a machine equipped with an inkjet unit for resin printing and circuit printing, a dispenser unit for printing conductive paste and epoxy resins, and a mounting machine for placing parts.
All the functions required for the manufacture of electronic devices are incorporated in a single machine.
FPM-Trinity key processes
FPM-Trinity is a collection of Fuji's own advanced processes in order to produce high quality electronic devices.
Create three-dimensional devices
◆Stacked board structure
Multiple units are stacked and combined to create a three-dimensional electronic module.
The layers of the boards can be electrically coupled by making contact with spring probe pins.
◆Reprinting and placing after placing parts
Resin can be printed again on the board after placing parts to encapsulate the parts in resin.
Also, by printing resin, printing circuits, and placing parts repeatedly on boards after placing parts, it is possible to form boards with multiple layers of placed parts.
We are currently in the process verification stage, but we are developing processes to produce multi-layer boards with placed parts completely automatically.
Guidelines for design rules
Item | Specifications(as of June 2023) | |
---|---|---|
Material | Resin | UV curable (orange clear type) |
Circuits | Silver nano particle ink | |
Component connections, electrodes | Silver conductive paste | |
Component securing | Epoxy adhesive (black color) | |
Resin formation | Max resin build size | 120 x 60 x 4 mm |
Circuit formation | Trace width | Minimum: 140 um, Maximum: 1,000 um |
Maximum layer count | 5 | |
Layer interconnections | Blind vias (non-stacking) | |
Part placement | Placement method | SMD |
Chip size | 1005 (0402") to 2316 (1206") mm | |
Package parts size (QFN, QFP, SOP) |
Maximum size: 7 mm Maximum thickness: 1 mm |
|
Minimum electrode pitch | 0.5mm | |
Electrode surface finish | Sn, Au |