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Placement solutions for next generation wireless communication standard, 5G
Products / Technologies / Exhibitions
-- Part placement solution package for module parts --
As the world gears up for the next generation communication standard, 5G, even higher performance is being demanded of day-to-day items such as smartphones and wearable devices. Also, with the proliferation of the Internet of Things we have reached the point in which communication modules and sensors are now commonplace in our home appliances and cars. This in turn has led to explosive growth in demand for module parts. Fuji technology solutions provide solid support for module part placement and improve productivity when producing densely populated boards, to meet the needs of today's manufacturing of electronics.
-- Improved throughput for high-density placement --
High-speed placement of 43,000 cph
The combination of an H24A head with an M3 IIIS module makes it possible to achieve very high placement speeds with high-density placement. By purposefully speeding-up the strokes in the X and Y directions within the placement range of 0.5 to 30 mm, the range most used in high-density placement for products that are required to be smaller and thinner such as smartphone and module boards, Fuji has achieved an improvement of 9% in throughput for IPC 9850.
High-speed placement of 43,000 cph
High-speed multipurpose placing machine - NXT III M3 IIIS
-- Effective for placement of parts with low tacking strength --
Catering to the fine bumps on SiP modules
Catering to the fine bumps on SiP modules
In the realm of SiP modules, WLCSPs with solder bumps no bigger than 100 μm are on the rise. WLCSPs are small in comparison to chip parts in terms of contact to the panel, and this means that the tacking strength between the parts and panel is low. Because of this, it is possible that parts may remain on the nozzle or become displaced from their placed position by an air blow after placement. The H24A head was developed so that the timing of the vacuum break blowing after placement could be changed, for stable part placement.
H24A head
High-speed multipurpose placing machine - NXT III M3 IIIS
H24A head
-- New vision processing system --
Superior vision processing for capturing even the most complex of parts
Superior vision processing for capturing even the most complex of parts
While the miniaturization of smartphones has been made possible through the use of many increasingly smaller module parts such as WLCSPs, the issue has arisen in which image recognition is less reliable within placement processes because circuit patterns and solder bumps overlap in images taken for the underside of the part, making it difficult to identify bumps. In answer to this, Fuji has developed the BP04CL camera. This camera uses finer lighting patterns with color lighting that can be used to prevent circuit patterns from being imaged during vision processing. With highly accurate image recognition, it is possible to achieve higher quality placements.
Standard lighting
image
image
BP04CL camera
lighting image
lighting image
Standard lighting
image
image
BP04CL camera
lighting image
lighting image
-- High-speed dip flux unit --
High-speed dipping and placement of very small bumped parts
High-speed dipping and placement of very small bumped parts
As package parts become smaller, so too does the diameter of the bumps on those parts. This means that the coating thickness of flux on transfer tables needs to be at the micron level. The minimum thickness of a uniform layer of flux that can be formed on a Fuji dip flux unit is 30 μm. By combining the high-speed dip flux unit with a high-speed rotary-type head, it is possible to place small parts with bumps like WLCSPs at high speed while transferring a uniform application of flux. Additionally, the dip flux unit can be set on the feeder pallet just like feeders.
NXT III product information
Inquiries
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