Case Studies

Examples of AME Tech applications

Case. 1

Miniaturization of Actuator Boards

Issue

Due to constraints on the size of boards, the entire enclosure cannot be made smaller

Solutions and
results
  • Changed from connector bonding to direct through-hole bonding using AME
  • Reduced XY dimensions by stacking three layers of boards
  • Incorporated various placed parts between the layers of the connection through-holes
Case. 2

Structural Conversion of Rigid-Flex Boards

Issue

The distance between rigid boards cannot be reduced due to bending radius limitations for the flexible circuit.

Solutions and
results
  • Direct through-hole connections between rigid boards using AME
  • Remove the flexible circuit bending structure to reduce bending space to zero
  • Minimize the gap between the upper and lower rigid boards to the absolute minimum
Case. 3

Prototyping of custom IoT boards for research

Issue

Reducing Lead Times for Small-Volume Custom Board Prototyping is Difficult

Solutions and
results
  • Fully mask-free digital manufacturing, from board to assembly
  • Rapid prototyping, even for single-unit production
  • Easy implementation of unique structures made possible by additive manufacturing

Seeking Co-development Partners

We are also seeking companies interested in collaborating with us to develop applications that leverage our technologies.
Ideas that were difficult to realize using conventional manufacturing methods can now be brought to life
with greater creative freedom through additive manufacturing.

If you are interested in our technologies or applications, please contact us.

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