Growth Strategy
Long-Term Vision
We have formulated "FUJI 2035" as our vision for Fuji in 2035 and announced it in May 2024.
FUJI 2035
Provides innovation to the world as a global company that contribute to manufacturing, lifestyle, and the future.
Mid-Term Business Plan 2026
Positioning the period through FY2027 as a groundwork phase for future growth, we will work to restructure our business portfolio and enhance our social and corporate value under the Mid-Term Business Plan 2026 toward the realization of FUJI 2035.

Financial targets
- Net sales
- 127 billion yen
- Operating profit
- 13.4 billion yen
- ROE
- 4.6%
 
- PBR
- 1.1x
- Net sales
- 180 billion yen
- Operating profit
- 33 billion yen
- ROE
- 11.0% or more (Revised from 10% in May 2026)
- PBR
- 1.1 times or more
Three basic policies
Expand existing businesses and strengthen profitability
We strive to increase sales and strengthen profitability in our main businesses of SMT pick and place machines (mounters) and semiconductor manufacturing equipment (die bonders).
In particular, the market size for mounters is expected to expand to 500 billion yen by 2030. Fuji is focusing on expanding our business by targeting growth markets such as automotive, semiconductors, and AI servers, in addition to our core smartphone market, and is working to acquire new customers through the expanded sales of new models (NXTR and AIMEXR).
Furthermore, we will continue to provide automation solutions for entire factories as a way to address labor shortages expected to result from the declining working population in the future.
Business strategy for SMT pick and place machines (mounters)
Advances in automotive electronics
Automobiles use a large number of electronic components such as sensors, cameras, and control units.
In recent years, the number of electronic boards installed in each car has increased due to the spread of autonomous driving and electric vehicles (EVs). Furthermore, the number of electronic components placed on each board is increasing, resulting in higher functionality and greater placement density.

Fuji Product Advantage
Support greater functionality and higher placement density with high-end models offering high speed and accuracy
- Increasing functionality in electronic devices
Various electronic devices such as smartphones and wearable devices are becoming smaller and more functional every year. In order to integrate advanced functions into a small space, the number of module components and SiPs (System in Package) that combine multiple chips and components into one package is increasing.
High accuracy, high density placement is required to integrate complex and delicate components into a single package.
Fuji Product Advantage
Support high accuracy placement of ±10 um
- AI servers
AI servers are increasing worldwide to handle large-scale data processing for applications such as generative AI and autonomous driving.
AI servers use large boards equipped with many high-performance electronic components at high placement density, as they perform many times more calculations than general computers.
Fuji Product Advantage
Support large boards up to 1068 x 610 mm
Offering factory-wide automation solutions
Challenges at production sites
- Labor shortages
- Skills becoming person-dependent
- Discrepancies between production plans and actual results
- Time lost due to changeovers
- Quality stability
Fuji Advantage
Solves challenges with FUJI Smart Factory solutions

- 1Resolving labor shortages through automation
Tasks such as production preparation, component supply, and inter-process transport are automated to enable unmanned factories.
Automation also helps reduce defective products caused by human error. - 2Preventing errors in advance with data analysis
Production equipment operation data and camera images are analyzed to detect early signs of errors before they develop into equipment issues or warning alarms.
By automatically replacing affected units and issuing maintenance instructions, unexpected equipment downtime can be prevented and stable production is maintained.
Business strategy for semiconductor manufacturing equipment (die bonders)
Product information for semiconductor manufacturing equipment (die bonders)

Strengthening development infrastructure
- Completed the construction of a new R&D building at Fasford Technology (group company) in November 2023
- Developing advanced semiconductor packaging technologies

Create and commercialize next-generation businesses
In order to realize our purpose of "Enriching the lives of those in the world around us", we engage in research and development and pursue new business creation in various fields, while striving to enhance profitability.
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Improve business foundations based on ESG
We will continue to strive to build and strengthen a sustainable and trustworthy corporate structure that takes into consideration the environment, society, and governance.
- Disclosure that conforms to TCFD
- Promoting carbon neutrality across the entire value chain
- Implementation of environmental innovation based on LCA

- Ratio of female managers: 5%
- Ratio of mid-career hires: 30%
- Paternity leave utilization rate: 70% or higher
- Enhance employee engagement
- Digital transformation-oriented personnel ratio: 10% or higher
- Reduce employee turnover rates
- Establish new recruitment methods
- Obtain White 500 recognition for outstanding health and productivity management
- *FY2027 target (non-consolidated)
- Promote group management structure
- Review business portfolios
- Strengthen risk management
- BCP for the supply chain
- Improve results of effectiveness evaluation on board of director meetings
- Strengthen information security
Facing challenges drives the future.
DNA that never stops evolving.
Human stories woven through technology.