NoticesIR
Newsroom
2026
NoticesIR
First Quarter 2027 Financial Result Explanatory Materials (August 3, 2026)
NoticesIR
Notice of Revision to Forecast of Business Results[PDF:133.5KB]
NoticesIR
First Quarter 2027 Financial Statements[PDF:263.2KB]
ReleasesProducts
Fuji Enables SMT Placement of Large, Heavy Components for AI Servers[PDF:190.2KB]
NoticesIR
Notice regarding the Completion of Payment for Disposal of Treasury Shares for Transfer-Restricted Stock Compensation[PDF:105.3KB]
NoticesCompany
Announcement of Organizational Changes[PDF:104.1KB]
NoticesIR
Notice of Resolutions of the 80th Ordinary General Meeting of Shareholders[PDF:102.0KB]
NoticesIR
Notice regarding the Disposal of Treasury Shares for Transfer-Restricted Stock Compensation[PDF:153.3KB]
NoticesIR
Fiscal 2026 Annual Securities Report[PDF:358.1KB]
NoticesCompanyIR
[Delayed]Notice of Resignation of Outside Board Member and Partial Withdrawal of Proposal for the 80th Ordinary General Meeting of Shareholders[PDF:157.4KB]
NoticesIR
Notice of First Quarter 2027 Financial Results Disclosure
NoticesIR
Notice of Convocation of the 80th Ordinary General Meeting of Shareholders and Relevant Business Information[PDF:1.0MB]
ReleasesProductsEvents
Introducing the CLT-FG: A New Compact All-in-One Placement Machine[PDF:194.5KB]
ReleasesProductsEvents
World’s First! Auto Kitting Station Accelerates Unmanned SMT Production Through Automated Kitting[PDF:617.0KB]
NoticesSustainability
Fuji Receives “A” Rating in CDP’s 2025 Supplier Engagement Assessment[PDF:192.9KB]
NoticesIR
Fiscal 2026 Financial Result Explanatory Materials (May 14, 2026)[PDF:3.5MB]
NoticesIR
Notice of the Recording of Extraordinary Losses, Differences Between the Forecast of Consolidated Results and the Actual Results for the Fiscal Year Ended March 31, 2026, and Dividends of Surplus[PDF:108.9KB]
NoticesIR
Fiscal 2026 Financial Statements[PDF:327.3KB]
ReleasesProducts
Fuji Awarded "2026 NPI Awards" in Two Categories for Automation Technology in SMT Manufacturing[PDF:553.8KB]
NoticesCompanyIR
Notice Regarding Changes to Senior Management[PDF:88.2KB]
ReleasesCompany
FUJI Group’s Fasford Technology to Unveil Next-Generation Die Bonder “XERDIA” at SEMICON CHINA 2026 for the First Time[PDF:391.6KB]
ReleasesProducts
Fuji to Conduct R&D on High Accuracy Semiconductor Die Placement Processes under SATAS Initiative[PDF:344.5KB]
ReleasesProducts
Fuji Launches Latest Mobility Support Robot for Home Care “Hug L1-02” ― Orders to Begin at the End of March 2026[PDF:302.3KB]
NoticesIR
Third Quarter 2026 Financial Result Explanatory Materials (February 10, 2026)[PDF:3.0MB]
NoticesIR
Notice of Revision to Forecast of Business Results[PDF:126.0KB]
NoticesIR
Third Quarter 2026 Financial Statements[PDF:262.8KB]
ReleasesProducts
Fuji Succeeds in World-First 016008 mm (006003") Component Placement - Pursuing next-generation placement technology in the AI era -[PDF:266.9KB]
NoticesProductsEvents
JISSO Seminar 2025 in ASEAN[PDF:359.9KB]
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