NEWS
Thank you for joining us at NEPCON ASIA 2019.
Products / Technologies / ExhibitionsThank you for joining us at NEPCON ASIA 2019.
We recently showcased the latest models of our machines at this year's show that ran for three days from August 28th through 30th at the Shenzhen Convention and Exhibition Center. This year's NEPCON ASIA was a very successful three-day event. We would like to thank everyone who helped make this a success.
FUJI Smart Factory Platform NXTR
This machine aims to free operators from repetitive tasks and maintain a high level of quality and productivity. We held a demonstration that showed the Smart Loader performing automatic part supply, and changeover for next production without stopping the machine. These are integral to the "three zeros concept": zero placement defects, zero machine stops, and zero machine operators, that the machine was developed upon.
Cutting edge placement solutions
The NXT III is able to provide flexible support for a variety of placements, such as the fine pitch placements required for 0201 (008004") sized parts, high-speed dipping for flux transfer on small parts such as WLCSPs, and placing parts that have uneven surfaces such as interposers.
For the NXT-H, we introduced hybrid production of wafer parts and SMDs, and direct pickup from wafers and support for large panels up to 610 x 610 mm as new solutions for IGBT and power module manufacturing processes.
For more information on NXT III: Click here
For more information on NXT-H: Click here
Automation solutions for manual processes
The automation of manual processes for which the work can be retained as data is a must when introducing smart factories as a way of improving QCD.
Visitors could also see the performance of the sFAB-alpha; an all-in-one inserter that can handle radial parts, axial parts, and jumper wires, the sFAB-D; a multipurpose fabrication machine that automates the manual processes that remain after SMT stages, and SmartWing; a compact multi-joint robot that makes the essential task for full automation of arranging parts possible without teaching.
For more information on sFAB-D: Click here
For more information on SmartWing: Click here
For more information on sFAB-D: Click here
For more information on SmartWing: Click here
In addition to these, we were also pleased to share our other machines and solutions such as the AIMEX III, as well as our Tough Plasma FPF-GM unit that vastly improves the bonding strength of surfaces, and our GPX-CL solder printer that supports large panels such as those for 5G base stations and other network infrastructures.
For more information on Tough Plasma FPF-GM: Click here
For more information on AIMEX III: Click here
The feedback that we received from everyone who came is greatly appreciated. The support that you give us is what allows us to continue to strive toward products and services that exceed expectations.
We are looking forward to seeing you next time.